IP Library Granted Patent US 5,537,328
Granted Patent Utility
US 5,537,328 · App. 08/004,741

Method for laying out power supply wiring conductors in integrated circuits

Inventor: Soichi Ito
Patented Case View Patent ↗
Granted: Jul 16, 1996 Filed: Jan 14, 1993
Inventor
Soichi Ito
Assignee (at issue)
NEC CORPORATION

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Quick Facts
Patent No.
US 5,537,328
App. No.
08/004,741
Filed
1993-01-14
Granted
1996-07-16
Kind
A