Granted Patent
Utility
US 5,545,466 · App. 08/500,540
Copper-clad laminate and printed wiring board
Inventors:
Muneo Saida, Yutaka Hirasawa, Katsuhiro Yoshimura
Patented Case
View Patent ↗
Granted: Aug 13, 1996
Filed: Jul 11, 1995
Inventors
Muneo Saida
Yutaka Hirasawa
Katsuhiro Yoshimura
Assignee (at issue)
MITSUI MINING & SMELTING CO., LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.