Granted Patent
Utility
US 5,559,316 · App. 08/310,698
Plastic-molded semiconductor device containing a semiconductor pellet mounted on a lead frame
Inventor:
Yoshiyuki Tomoda
Patented Case
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Granted: Sep 24, 1996
Filed: Sep 22, 1994
Inventor
Yoshiyuki Tomoda
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.