IP Library › Granted Patent US 5,559,363
Granted Patent Utility
US 5,559,363 · App. 08/469,706

Off-chip impedance matching utilizing a dielectric element and high density interconnect technology

Inventor: Anthony A. Immorlica
Patented Case View Patent ↗
Granted: Sep 24, 1996 Filed: Jun 6, 1995
Inventor
Anthony A. Immorlica
Assignee (at issue)
LOCKHEED MARTIN CORPORATION

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Quick Facts
Patent No.
US 5,559,363
App. No.
08/469,706
Filed
1995-06-06
Granted
1996-09-24
Kind
A