IP Library › Granted Patent US 5,563,090
Granted Patent Utility
US 5,563,090 · App. 08/419,264

Method for forming rugged tungsten film and method for fabricating semiconductor device utilizing the same

Inventors: Young Jong Lee, Bok Won Cho
Patented Case View Patent ↗
Granted: Oct 8, 1996 Filed: Apr 10, 1995
Inventors
Young Jong Lee
Bok Won Cho
Assignee (at issue)
LG Semicon Co., Ltd.

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Quick Facts
Patent No.
US 5,563,090
App. No.
08/419,264
Filed
1995-04-10
Granted
1996-10-08
Kind
A