Granted Patent
Utility
US 5,572,070 · App. 08/383,511
Integrated circuit packages with heat dissipation for high current load
Inventor:
Richard J. Ross
Patented Case
View Patent ↗
Granted: Nov 5, 1996
Filed: Feb 6, 1995
Inventor
Richard J. Ross
Assignee (at issue)
RJR Polymers, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.