Granted Patent
Utility
US 5,578,524 · App. 08/413,868
Fabrication process of a semiconductor device with a wiring structure
Inventors:
Tadashi Fukase, Takehiko Hamada
Patented Case
View Patent ↗
Granted: Nov 26, 1996
Filed: Mar 29, 1995
Inventors
Tadashi Fukase
Takehiko Hamada
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.