Granted Patent
Utility
US 5,599,564 · App. 08/364,137
Automatic stamper exchange device and injection molding apparatus employing the exchange device
Inventors:
Koichi Ishihara, Kiyoshi Takii, Kozo Kawarazaki, Kazuhiro Oishi, Nobuyuki Hirayama
Patented Case
View Patent ↗
Granted: Feb 4, 1997
Filed: Dec 27, 1994
Inventors
Koichi Ishihara
Kiyoshi Takii
Kozo Kawarazaki
Kazuhiro Oishi
Nobuyuki Hirayama
Assignee (at issue)
SONY GROUP CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.