Granted Patent
Utility
US 5,610,443 · App. 08/524,869
Method for encapsulating a semiconductor utilizing an epoxy resin and an onium salt compound
Inventors:
Akihiro Inagaki, Isao Yamamura
Patented Case
View Patent ↗
Granted: Mar 11, 1997
Filed: Sep 7, 1995
Inventors
Akihiro Inagaki
Isao Yamamura
Assignee (at issue)
General Instrument of Taiwan, Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.