Granted Patent
Utility
US 5,614,444 · App. 08/469,164
Method of using additives with silica-based slurries to enhance selectivity in metal CMP
Inventors:
János Farkas, Rahul Jairath, Matt Stell, Sing-Mo Tzeng
Patented Case
View Patent ↗
Granted: Mar 25, 1997
Filed: Jun 6, 1995
Inventors
János Farkas
Rahul Jairath
Matt Stell
Sing-Mo Tzeng
Assignees (at issue)
Sematech, Inc.
Intel Corporation
NATIONAL SEMICONDUCTOR CORPORATION
Digital Equipment Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.