Granted Patent
Utility
US 5,668,406 · App. 08/767,635
Semiconductor device having shielding structure made of electrically conductive paste
Inventor:
Hidenori Egawa
Patented Case
View Patent ↗
Granted: Sep 16, 1997
Filed: Dec 17, 1996
Inventor
Hidenori Egawa
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.