Granted Patent
Utility
US 5,681,423 · App. 08/659,758
Semiconductor wafer for improved chemical-mechanical polishing over large area features
Inventors:
Gurtej S. Sandhu, Chris C. Yu
Patented Case
View Patent ↗
Granted: Oct 28, 1997
Filed: Jun 6, 1996
Inventors
Gurtej S. Sandhu
Chris C. Yu
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.