Granted Patent
Utility
US 5,703,405 · App. 08/591,194
Integrated circuit chip formed from processing two opposing surfaces of a wafer
Inventor:
Kenneth Arthur Zeber
Patented Case
View Patent ↗
Granted: Dec 30, 1997
Filed: Jan 16, 1996
Inventor
Kenneth Arthur Zeber
Assignee (at issue)
Motorola, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.