Granted Patent
Utility
US 5,706,579 · App. 08/631,649
Method of assembling integrated circuit package
Inventor:
Richard J. Ross
Patented Case
View Patent ↗
Granted: Jan 13, 1998
Filed: Apr 9, 1996
Inventor
Richard J. Ross
Assignee (at issue)
RJR Polymers, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.