Granted Patent
Utility
US 5,708,419 · App. 08/681,195
Method of wire bonding an integrated circuit to an ultraflexible substrate
Inventors:
Mark R. Isaacson, Anthony F. Piccoli, Michael Holloway
Patented Case
View Patent ↗
Granted: Jan 13, 1998
Filed: Jul 22, 1996
Inventors
Mark R. Isaacson
Anthony F. Piccoli
Michael Holloway
Assignee (at issue)
CHECKPOINT SYSTEMS, INC.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.