IP Library › Granted Patent US 5,712,204
Granted Patent Utility
US 5,712,204 · App. 08/575,475

Method of making a semiconductor device having reduced junction capacitance between the source and drain regions and the substrate

Inventor: Tadahiko Horiuchi
Patented Case View Patent ↗
Granted: Jan 27, 1998 Filed: Dec 20, 1995
Inventor
Tadahiko Horiuchi
Assignee (at issue)
NEC CORPORATION

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Quick Facts
Patent No.
US 5,712,204
App. No.
08/575,475
Filed
1995-12-20
Granted
1998-01-27
Kind
A