Granted Patent
Utility
US 5,712,570 · App. 08/530,558
Method for checking a wire bond of a semiconductor package
Inventors:
Young Wok Heo, Dong Sin Youm
Patented Case
View Patent ↗
Granted: Jan 27, 1998
Filed: Sep 19, 1995
Inventors
Young Wok Heo
Dong Sin Youm
Assignees (at issue)
Anam Industrial Co., Ltd.
Amkor Electronics, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.