Granted Patent
Utility
US 5,723,257 · App. 08/660,183
Si containing high molecular compound and photosensitive resin composition
Inventor:
Shigeyuki Iwasa
Patented Case
View Patent ↗
Granted: Mar 3, 1998
Filed: May 31, 1996
Inventor
Shigeyuki Iwasa
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.