Granted Patent
Utility
US 5,731,962 · App. 08/532,885
Semiconductor device free from short-circuit due to resin pressure in mold
Inventor:
Tomoo Imura
Patented Case
View Patent ↗
Granted: Mar 24, 1998
Filed: Sep 22, 1995
Inventor
Tomoo Imura
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.