Granted Patent
Utility
US 5,736,234 · App. 08/604,481
Multilayer printed circuit board having latticed films on an interconnection layer
Inventor:
Harumi Mizunashi
Patented Case
View Patent ↗
Granted: Apr 7, 1998
Filed: Feb 21, 1996
Inventor
Harumi Mizunashi
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.