Granted Patent
Utility
US 5,739,050 · App. 08/592,204
Method and apparatus for assembling a semiconductor package for testing
Inventor:
Warren M. Farnworth
Patented Case
View Patent ↗
Granted: Apr 14, 1998
Filed: Jan 26, 1996
Inventor
Warren M. Farnworth
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.