Granted Patent
Utility
US 5,751,699 · App. 08/669,631
Multidimensional aspects of an ASIC bus structure
Inventor:
William H. Radke
Patented Case
View Patent ↗
Granted: May 12, 1998
Filed: Jun 24, 1996
Inventor
William H. Radke
Assignee (at issue)
Sun Microsystems Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.