Granted Patent
Utility
US 5,760,473 · App. 08/670,810
Semiconductor package having a eutectic bonding layer
Inventors:
Joseph F. Dickson, Lee B. Max
Patented Case
View Patent ↗
Granted: Jun 2, 1998
Filed: Jun 25, 1996
Inventors
Joseph F. Dickson
Lee B. Max
Assignee (at issue)
BRUSH WELLMAN, INC.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.