Granted Patent
Utility
US 5,767,824 · App. 08/876,805
High-density, three-dimensional, intercoupled circuit structure
Inventor:
Stephen C. Jacobsen
Patented Case
View Patent ↗
Granted: Jun 16, 1998
Filed: Jun 16, 1997
Inventor
Stephen C. Jacobsen
Assignee (at issue)
Sarcos Corp.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.