Granted Patent
Utility
US 5,770,891 · App. 08/718,120
Socket for semi-permanently connecting a solder ball grid array device using a dendrite interposer
Inventors:
Richard F. Frankeny, Jerome A. Frankeny, Danny E. Massey, Keith A. Vanderlee
Patented Case
View Patent ↗
Granted: Jun 23, 1998
Filed: Sep 18, 1996
Inventors
Richard F. Frankeny
Jerome A. Frankeny
Danny E. Massey
Keith A. Vanderlee
Assignee (at issue)
International Business Machines Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.