Granted Patent
Utility
US 5,783,477 · App. 08/835,948
Method for bonding compounds semiconductor wafers to create an ohmic interface
Inventors:
Fred A. Kish, Jr., David A. Vanderwater
Patented Case
View Patent ↗
Granted: Jul 21, 1998
Filed: Apr 14, 1997
Inventors
Fred A. Kish, Jr.
David A. Vanderwater
Assignee (at issue)
Hewlett-Packard Company, L.P.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.