Granted Patent
Utility
US 5,795,063 · App. 08/543,867
Method and apparatus for thermal impedance evaluation of packaged semiconductor components
Inventors:
Filip Christiaens, Luc Tielemans, Luc De Schepper, Eric Beyne
Patented Case
View Patent ↗
Granted: Aug 18, 1998
Filed: Oct 19, 1995
Inventors
Filip Christiaens
Luc Tielemans
Luc De Schepper
Eric Beyne
Assignee (at issue)
INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM VZW
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.