Granted Patent
Utility
US 5,808,529 · App. 08/678,982
Printed circuit board layering configuration for very high bandwidth interconnect
Inventor:
John David Hamre
Patented Case
View Patent ↗
Granted: Sep 15, 1998
Filed: Jul 12, 1996
Inventor
John David Hamre
Assignee (at issue)
Storage Technology Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.