Granted Patent
Utility
US 5,825,088 · App. 08/037,508
Low thermal resistance semiconductor package and mounting structure
Inventor:
Howard D. Bartlow
Patented Case
View Patent ↗
Granted: Oct 20, 1998
Filed: Mar 24, 1993
Inventor
Howard D. Bartlow
Assignee (at issue)
Spectrian Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.