Granted Patent
Utility
US 5,847,457 · App. 08/738,040
Structure and method of forming vias
Inventors:
Fusen Chen, Fu-Tai Liou, Girish Dixit
Patented Case
View Patent ↗
Granted: Dec 8, 1998
Filed: Oct 24, 1996
Inventors
Fusen Chen
Fu-Tai Liou
Girish Dixit
Assignee (at issue)
STMICROELECTRONICS, INC.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.