Granted Patent
Utility
US 5,861,660 · App. 08/710,356
Integrated-circuit die suitable for wafer-level testing and method for forming the same
Inventor:
David C. McClure
Patented Case
View Patent ↗
Granted: Jan 19, 1999
Filed: Sep 17, 1996
Inventor
David C. McClure
Assignee (at issue)
STMICROELECTRONICS, INC.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.