IP Library › Granted Patent US 5,886,407
Granted Patent Utility
US 5,886,407 · App. 08/654,974

Heat-dissipating package for microcircuit devices

Inventors: Frank J. Polese, Vladimir Ocheretyansky
Patented Case View Patent ↗
Granted: Mar 23, 1999 Filed: May 28, 1996
Inventors
Frank J. Polese
Vladimir Ocheretyansky
Assignee (at issue)
Frank J. Polese

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Quick Facts
Patent No.
US 5,886,407
App. No.
08/654,974
Filed
1996-05-28
Granted
1999-03-23
Kind
A