Granted Patent
Utility
US 5,891,762 · App. 08/686,416
Method of forming a semiconductor device by using a conductive film as an etching stopper
Inventors:
Hiroyuki Sakai, Atsuhiro Kajiya, Hisashi Ogawa
Patented Case
View Patent ↗
Granted: Apr 6, 1999
Filed: Jul 26, 1996
Inventors
Hiroyuki Sakai
Atsuhiro Kajiya
Hisashi Ogawa
Assignee (at issue)
Matsushita Electronics Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.