Granted Patent
Utility
US 5,894,160 · App. 08/725,621
Method of forming a landing pad structure in an integrated circuit
Inventors:
Tsiu C. Chan, Frank R. Bryant, Loi N. Nguyen
Patented Case
View Patent ↗
Granted: Apr 13, 1999
Filed: Oct 3, 1996
Inventors
Tsiu C. Chan
Frank R. Bryant
Loi N. Nguyen
Assignee (at issue)
STMICROELECTRONICS, INC.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.