Granted Patent
Utility
US 5,900,164 · App. 08/954,979
Method for planarizing a semiconductor device surface with polymeric pad containing hollow polymeric microelements
Inventors:
William D. Budinger, Elmer Jensen, Harry McClain, John V. H. Roberts, Heinz Reinhardt
Patented Case
View Patent ↗
Granted: May 4, 1999
Filed: Oct 20, 1997
Inventors
William D. Budinger
Elmer Jensen
Harry McClain
John V. H. Roberts
Heinz Reinhardt
Assignee (at issue)
Rodel Holdings, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.