Granted Patent
Utility
US 5,909,636 · App. 08/802,811
Method of forming a landing pad structure in an integrated circuit
Inventors:
Loi N. Nguyen, Frank R. Bryant, Artur P. Balasinski
Patented Case
View Patent ↗
Granted: Jun 1, 1999
Filed: Feb 18, 1997
Inventors
Loi N. Nguyen
Frank R. Bryant
Artur P. Balasinski
Assignee (at issue)
STMICROELECTRONICS, INC.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.