Granted Patent
Utility
US 5,914,518 · App. 08/759,759
Method of forming a metal contact to landing pad structure in an integrated circuit
Inventors:
Loi N. Nguyen, Frank R. Bryant
Patented Case
View Patent ↗
Granted: Jun 22, 1999
Filed: Dec 3, 1996
Inventors
Loi N. Nguyen
Frank R. Bryant
Assignee (at issue)
STMICROELECTRONICS, INC.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.