Granted Patent
Utility
US 5,923,087 · App. 08/782,394
Semiconductor device comprising bonding pad of barrier metal, silicide and aluminum
Inventors:
Hiromi Suzuki, Toshinori Sato
Patented Case
View Patent ↗
Granted: Jul 13, 1999
Filed: Jan 13, 1997
Inventors
Hiromi Suzuki
Toshinori Sato
Assignee (at issue)
Nippon Precision Circuits Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.