Granted Patent
Utility
US 5,926,736 · App. 08/741,255
Low temperature aluminum reflow for multilevel metallization
Inventor:
Melvin Joseph DeSilva
Patented Case
View Patent ↗
Granted: Jul 20, 1999
Filed: Oct 30, 1996
Inventor
Melvin Joseph DeSilva
Assignee (at issue)
STMICROELECTRONICS, INC.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.