Granted Patent
Utility
US 5,929,511 · App. 08/891,805
Lead frame for resin sealed semiconductor device
Inventors:
Eiichi Nakazawa, Takashi Ikeda, Tomohiko Iwasaki, Tadahiko Aiba, Shigeo Yoshida
Patented Case
View Patent ↗
Granted: Jul 27, 1999
Filed: Jul 14, 1997
Inventors
Eiichi Nakazawa
Takashi Ikeda
Tomohiko Iwasaki
Tadahiko Aiba
Shigeo Yoshida
Assignee (at issue)
Matsushita Electronics Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.