Granted Patent
Utility
US 5,929,524 · App. 08/760,215
Semiconductor device having ring-shaped conductive spacer which connects wiring layers
Inventors:
John M. Drynan, Kuniaki Koyama
Patented Case
View Patent ↗
Granted: Jul 27, 1999
Filed: Dec 4, 1996
Inventors
John M. Drynan
Kuniaki Koyama
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.