Granted Patent
Utility
US 5,933,710 · App. 08/910,608
Method of providing electrical connection between an integrated circuit die and a printed circuit board
Inventors:
Chok J. Chia, Patrick Variot
Patented Case
View Patent ↗
Granted: Aug 3, 1999
Filed: Aug 13, 1997
Inventors
Chok J. Chia
Patrick Variot
Assignee (at issue)
LSI Logic Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.