Granted Patent
Utility
US 5,950,072 · App. 08/900,674
Low-profile removable ball-grid-array integrated circuit package
Inventor:
Daniel G. Queyssac
Patented Case
View Patent ↗
Granted: Sep 7, 1999
Filed: Jul 25, 1997
Inventor
Daniel G. Queyssac
Assignee (at issue)
STMICROELECTRONICS, INC.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.