IP Library Granted Patent US 5,952,723
Granted Patent Utility
US 5,952,723 · App. 08/827,411

Semiconductor device having a multilevel interconnection structure

Inventors: Nobuyuki Takeyasu, Hiroshi Yamamoto, Yumiko Kawano, Eiichi Kondoh, Tomoharu Katagiri, Tomohiro Ohta
Patented Case View Patent ↗
Granted: Sep 14, 1999 Filed: Mar 27, 1997
Inventors
Nobuyuki Takeyasu
Hiroshi Yamamoto
Yumiko Kawano
Eiichi Kondoh
Tomoharu Katagiri
Tomohiro Ohta
Assignee (at issue)
Kawasaki Steel Corporation

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Quick Facts
Patent No.
US 5,952,723
App. No.
08/827,411
Filed
1997-03-27
Granted
1999-09-14
Kind
A