IP Library › Granted Patent US 5,958,572
Granted Patent Utility
US 5,958,572 · App. 08/941,793

Hybrid substrate for cooling an electronic component

Inventors: Detlef Schmidt, Martin R. Pais
Patented Case View Patent ↗
Granted: Sep 28, 1999 Filed: Sep 30, 1997
Inventors
Detlef Schmidt
Martin R. Pais
Assignee (at issue)
Motorola, Inc.

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Quick Facts
Patent No.
US 5,958,572
App. No.
08/941,793
Filed
1997-09-30
Granted
1999-09-28
Kind
A