Granted Patent
Utility
US 5,960,961 · App. 09/128,306
Tab means to assure ready release of singulated wafer die or integrated circuit chips packed in adhesive backed carrier tapes
Inventor:
Charles Gutentag
Patented Case
View Patent ↗
Granted: Oct 5, 1999
Filed: Aug 3, 1998
Inventor
Charles Gutentag
Assignee (at issue)
Tempo G
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.