IP Library › Granted Patent US 5,971,734
Granted Patent Utility
US 5,971,734 · App. 08/934,315

Mold for ball grid array semiconductor package

Inventor: Young Yeob Moon
Patented Case View Patent ↗
Granted: Oct 26, 1999 Filed: Sep 19, 1997
Inventor
Young Yeob Moon
Assignees (at issue)
Anam Semiconductor
Amkor Technology, Inc.

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Quick Facts
Patent No.
US 5,971,734
App. No.
08/934,315
Filed
1997-09-19
Granted
1999-10-26
Kind
A