Granted Patent
Utility
US 5,990,005 · App. 08/799,037
Method of burying a contact hole with a metal for forming multilevel interconnections
Inventors:
Kazuyuki Hirose, Kuniko Miyakawa
Patented Case
View Patent ↗
Granted: Nov 23, 1999
Filed: Feb 10, 1997
Inventors
Kazuyuki Hirose
Kuniko Miyakawa
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.