Granted Patent
Utility
US 5,994,774 · App. 08/960,947
Surface mountable integrated circuit package with detachable module and interposer
Inventors:
Harry Michael Siegel, Michael J. Hundt, Robert H. Bond
Patented Case
View Patent ↗
Granted: Nov 30, 1999
Filed: Oct 30, 1997
Inventors
Harry Michael Siegel
Michael J. Hundt
Robert H. Bond
Assignee (at issue)
STMICROELECTRONICS, INC.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.