Granted Patent
Utility
US 6,001,729 · App. 09/134,372
Method of forming wiring structure for semiconductor device
Inventors:
Hiroshi Shinriki, Takayuki Komiya, Hiroshi Yamamoto
Patented Case
View Patent ↗
Granted: Dec 14, 1999
Filed: Aug 14, 1998
Inventors
Hiroshi Shinriki
Takayuki Komiya
Hiroshi Yamamoto
Assignee (at issue)
Kawasaki Steel Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.